That's me(left) and Madhav(right) assembling the primary bracket
FirstFT: the day's biggest stories
。safew对此有专业解读
I’m not an expert at wire bonding although I’ve done lab scale gold ball bonding before so I understand the basics of the process and I’ve never seen this deep an indent before. Could this be an indication of too much pressure or ultrasonic power? Would love comments from people who actually run high volume bonders as to whether this is indicative of poor process control, it sure seems fishy to me.
Run rcli actions to see all 43, or toggle them on/off in the TUI Actions panel.